MELSEC Selection Guide

Controller lineup

Serie	Modular type	Modular type	Baseless type
	MELSEC iQ-R	MELSEC-Q	MELSEC-L
	PAC (Programmable automation controller)	CPU del controlador programable	CPU del controlador programable
Línea	•  Programmable controller CPU •  CC-Link IE embedded CPU •  Safety CPU •  Process CPU*1 •  SIL2 Process CPU •  C Controller •  MELSECWinCPU •  Motion CPU •  Robot CPU •  CNC CPU	•  Programmable controller CPU (Universal model) •  Process CPU (Universal model) •  C Controller •  Motion CPU •  Robot controller •  CNC CPU	•  Programmable controller CPU  Tipo sink  Tipo fuente
Método de control	Funcionamiento cíclico del programa almacenado	Funcionamiento cíclico del programa almacenado	Funcionamiento cíclico del programa almacenado
Modo de control de E/S	Modo de actualización	Modo de actualización	Modo de actualización
Lenguaje de programación	•  Ladder diagram •  Structured text (ST) •  Sequential function chart (SFC)*2 •  Function block diagram (FBD/LD) •  Function block (FB) •  C/C++*3	•  Ladder diagram •  Structured text (ST) •  Instruction list •  MELSAP3 (SFC), MELSAP-L •  Function block diagram (FBD) •  Function block (FB) •  C/C++*3	•  Ladder diagram •  Structured text (ST) •  Instruction list •  MELSAP3 (SFC), MELSAP-L •  Function block (FB)
Ingeniería ambiental	MELSOFT GX Works3 MELSOFT MT Works2 CW Workbench	MELSOFT GX Works2 MELSOFT PX Developer MELSOFT MT Works2 CW Workbench	MELSOFT GX Works2
Program size (K step)	1200	1000	260
Number of I/O points (X/Y) (point)	4096	4096	4096
Device/label memory/ standard RAM (K byte)	3380	1792	768
Data memory/standard ROM (byte)	40M	16M	2 M
Velocidad de procesamiento
LD instruction (ns)	0,98	1,9	9,5
MOV instruction (ns)	1,96	3,9	19
Floating point addition (µs)	0,01	0,014	0,057
Interfaz de memoria
Casete SRAM extendido	●	● *4	―
Tarjeta de memoria SD	●	● *4	● *5
SRAM card, FLASH card, ATA card	―	● *6	―
Interfaz externa
USB	●	●	●
Ethernet  (1000BASE-T*7/   100BASE-TX/   10BASE-T)	●	● *8	● *5
RS-232	● *9	● *10	● *11
RS-422/485	―	―	―
Unidad de pantalla	―	―	●
CC-Link IE connection port
Ethernet  (1000BASE-T/   100BASE-TX/   10BASE-T)	● *12	―	―
Network connectivity (adapter/module)
Ethernet  (1000BASE-T*13/   100BASE-TX/   10BASE-T)	●	●	●
CC-Link IE TSN	●	―	―
Control IE CC-Link	●	●	―
Campo CC-Link IE	●	● *14	●
CC-Link	●	●	●
SSCNET…¢/H	●	●	●
AnyWire	●	●	●
BACnet®	●	●	●
MODBUS®/TCP	●	●	●
MODBUS®	●	●	●
Especificaciones generales
Temperatura ambiente de funcionamiento	0...55℃ (60℃ *15)	0...55℃	0...55℃
Key features/functions	•  Line manufacturing •  Distributed control •  Small-scale I/O control •  Large-scale I/O control •  Security •  Inter-modular sync •  Built-in database •  Integrated network •  Multiple CPU •  Process control •  High-reliability control •  C programming •  Datalogging •  IT gateway •  Advanced motion •  Safety •  Real-time monitor	•  Line manufacturing •  Distributed control •  Large-scale I/O control •  Integrated network •  Multiple CPU •  Process control •  C programming •  Data logging •  IT gateway •  Advanced motion	•  Machine control •  Distributed control •  Small-scale I/O control •  Large-scale I/O control •  Space/cost saving •  Integrated network •  Extensive built-in functions •  Data logging •  Motion control •  Real-time monitor

Serie	Compact type		Compact type
	MELSEC iQ-F		MELSEC-F
	CPU del controlador programable		CPU del controlador programable
	FX5UJ	FX5U/FX5UC	FX3S	FX3G/FX3GC	FX3U/FX3UC
Línea	•  FX5UJ (screw terminal block type)	•  FX5U (screw terminal block type) •  FX5UC (connector type) •  FX5UC (spring clamp terminal block type)	•  FX3S	•  FX3G •  FX3GC	•  FX3U •  FX3UC
Método de control	Stored program cyclic operatio		Stored program cyclic operatio
Modo de control de E/S	Modo de actualización		Modo de actualización
Lenguaje de programación	•  Ladder diagram •  Structured text (ST) •  Function block diagram (FBD/LD) •  Function block (FB)	•  Ladder diagram •  Structured text (ST) •  Function block diagram (FBD/LD) •  Function block (FB) •  Sequential function chart (SFC)	•  Ladder diagram •  Structured text (ST) •  Function block diagram (FBD/LD) •  Function block (FB) •  Sequential function chart (SFC)
Ingeniería ambiental	MELSOFT GX Works3		MELSOFT GX Works2
Tamaño del programa (K step)	48	64/128	4	32	64
Number of I/O points [X/Y] (point)	256	384	30	128	256
Device/label memory/ standard RAM (K byte)	120	150	―	―	―
Data memory/ standard ROM (byte)	5 M	5 M	―	―	―
Velocidad de procesamiento
LD instruction (ns)	34	34*16	210	210	65
MOV instruction (ns)	34	34*16	520	520	640
Floating point addition (µs)	3,967	3,692	11,96	11,96	14,2
Interfaz de memoria
Casete SRAM extendido	―	―	●	● *17	●
Tarjeta de memoria SD	●	●	―	―	―
SRAM card, FLASH card, Tarjeta ATA	―	―	―	―	―
Interfaz externa
USB	●	―	●	●	―
Ethernet  (1000BASE-T*7/   100BASE-TX/   10BASE-T)	●	●	―	―	―
RS-232	―	―	―	―	―
RS-422/485	―	●	●	●	●
Unidad de pantalla	―	―	●	● *17	●
CC-Link IE connection port
Ethernet  (1000BASE-T/   100BASE-TX/   10BASE-T)	―	―	―	―	―
Network connectivity (adapter/module)
Ethernet  (1000BASE-T*13/   100BASE-TX/   10BASE-T)	●	●	●	●	●
CC-Link IE TSN	●	●	―	―	―
Control IE CC-Link	―	―	―	―	―
Campo CC-Link IE	●	●	―	―	―
CC-Link	●	●	―	●	●
SSCNET…¢/H	●	●	―	―	● *18
AnyWire	●	●	―	●	●
BACnet®	●	●	―	―	―
MODBUS®/TCP	●	●	―	―	―
MODBUS®	●	●	●	●	●
Especificaciones generales
Temperatura ambiente de funcionamiento	0...55℃	−0...55℃ *19	0...55℃	0...55℃	0...55℃
Key features/functions	•  Machine control •  Distributed control •  Small-scale I/O control •  Space/cost saving •  Security •  Integrated network •  Extensive built-in functions •  Data logging •  Motion contro		•  Machine control •  Small-scale I/O control •  Space/cost saving •  Motion control

• *1.Supports redundant system when paired with R6RFM
• *2.SFC is not supported in redundant mode and by safety CPU
• *3.When using CW Workbench
• *4.Q-UDVCPU only.
• *5.Does not support L02SCPU(-P)
• *6.Does not support QnUDVCPU and certain models
• *7.Supports the user Ethernet port of Q24DHCCPU-V/VG/LS and Q26DHCCPU-LS only
• *8.Supports Q-UDE(H)CPU and Q-UDVCPU only
• *9.Supports C Controller and MELSECWinCPU only
• *10.Does not support Q-UDE(H)CPU and Q-UDVCPU
• *11.Supports L02SCPU(-P) only
• *12.R-ENCPU only
• *13.Supports the MELSEC iQ-R Series only.
• *14.Does not support Q-(P)(H)CPU and Q-PRHCPU
• *15.Only supported when used together with extended temperature range main/extension base units
• *16.When the program capacity is 64K steps
• *17.Supports FX3G only
• *18.Supports SSCNET Ⅲ
• *19.Operating ambient temperature from -20℃   is supported by products produced from June 2016 (serial number "166" or later). For details, on supported products, please refer to the relevant product manual.